How to use Bond-Ply TBP 850 double-sided tape to create a strong and efficient thermal bond between an LED Module and the cooling surface.
- Clean the surfaces of the heat sink and LED module with isopropyl alcohol and allow to dry completely.
- Remove one side of the dual liners to expose the adhesive and carefully apply the tape to the cooling surface. Press firmly and evenly to ensure good contact and to eliminate any air bubbles.
- Remove the second liner and attach the LED module to the tape. Ensure it is properly positioned before pressing down.
- Using the supplied thermal press tool, apply a minimum of 20 psi of pressure to the LED module for at least 10 seconds. Applying higher pressure for a longer duration will enhance thermal performance and bond strength.
- The tape provides instant adhesion, allowing immediate use of the LED module.
- For maximum bond strength, allow 24 hours for the bond to cure fully.
Handling and Storage
- For optimal life & performance, store the Bond-Ply TBP 850 tape in a cool, dry place.
- Maximum storage temperature up to 35°C for a shelf life of 6 months and up to 45°C for a shelf life of 3 months.
Thermal Resistance | 4.5 °C/W |
Thickness | .005" (0.127 mm) |
Pad Size | 1" (25 mm ) Square |
Dialectric Voltage | 3000 AC AC |
Refer to the product datasheets for complete specifications. |
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Datasheets
RoHS Status | RoHS 3 Compliant |
REACH Status | REACH Uneffected |
Conflict Minerals Report | CMRT Rev 6.22 |
Proposition 65 Statement | Proposition 65 |
PFAS Declaration | PFAS Declaration |
ECCN | EAR99 |
HTS | 3919.90.50.60 |
Country of Origin | CA |
How to use Bond-Ply TBP 850 double-sided tape to create a strong and efficient thermal bond between an LED Module and the cooling surface.
- Clean the surfaces of the heat sink and LED module with isopropyl alcohol and allow to dry completely.
- Remove one side of the dual liners to expose the adhesive and carefully apply the tape to the cooling surface. Press firmly and evenly to ensure good contact and to eliminate any air bubbles.
- Remove the second liner and attach the LED module to the tape. Ensure it is properly positioned before pressing down.
- Using the supplied thermal press tool, apply a minimum of 20 psi of pressure to the LED module for at least 10 seconds. Applying higher pressure for a longer duration will enhance thermal performance and bond strength.
- The tape provides instant adhesion, allowing immediate use of the LED module.
- For maximum bond strength, allow 24 hours for the bond to cure fully.
Handling and Storage
- For optimal life & performance, store the Bond-Ply TBP 850 tape in a cool, dry place.
- Maximum storage temperature up to 35°C for a shelf life of 6 months and up to 45°C for a shelf life of 3 months.
Thermal Resistance | 4.5 °C/W |
Thickness | .005" (0.127 mm) |
Pad Size | 1" (25 mm ) Square |
Dialectric Voltage | 3000 AC AC |
Refer to the product datasheets for complete specifications. |
---|
Datasheets
RoHS Status | RoHS 3 Compliant |
REACH Status | REACH Uneffected |
Conflict Minerals Report | CMRT Rev 6.22 |
Proposition 65 Statement | Proposition 65 |
PFAS Declaration | PFAS Declaration |
ECCN | EAR99 |
HTS | 3919.90.50.60 |
Country of Origin | CA |